Senior Wafer Backend Process Engineer

• Responsible for enhancing and maintaining the wafer backend/coating process
• Possess comprehensive knowledge of semiconductor manufacturing and demonstrate the ability to gather and analyze data for the creation of engineering reports pertaining to new products and ongoing production.
• Oversee and sustain Assembly yield within key performance indicator (KPI) targets, including Output, Quality, and Scrap Cost
• Play a crucial role in system enhancements aimed at reducing scrap rates resulting from process deviations.
• Initiate enhancements to processes through thorough evaluations of test/yield data and manufacturing defects, making necessary adjustments to process equipment.
• Program, troubleshoot, and maintain manufacturing process equipment as needed to achieve targeted yield goals.
• Assist engineering projects in assessing new process introductions and new equipment setups, providing both tactical and strategic recommendations.
• Develop Manufacturing Work Instructions and production routes, as well as implement Engineering Change Orders when necessary.
• Well-versed in Statistical Process Control (SPC) and Risk Management/FMEA.

JOB REQUIREMENTS:

• Bachelor of Science/Engineering degree, preferably in Electronics/Electrical/Chemical
• A minimum of 5 years of professional experience in wafer backend, with 8 years in a semiconductor manufacturing environment being a significant advantage
• Willingness to work 12-hour shifts as needed
• Experience in semiconductor wafer backend manufacturing processes is preferred, including Coating, Die Saw, Scribe, and Cleave
• Strong problem-solving skills related to process analysis.
• Proficient in computer applications with knowledge of SAS JMP, Minitab, and SPC methodologies.
• Demonstrated analytical skills and a hands-on approach to machine troubleshooting is highly desirable.
• Ability to adapt and respond flexibly to quickly changing business requirements.
• Experience in supervising and leading a team of process personnel.