Senior Engineer (FOL Process)

Responsibilities

• Oversee the enhancement and maintenance of the Die Attach / Wire Bond Process.
• Possess comprehensive knowledge of electronics manufacturing and be capable of gathering and analyzing data to generate engineering reports for both new products and ongoing production.
• Track and ensure Assembly yield aligns with Key Performance Indicator (KPI) targets.
• Play a crucial role in system improvements to reduce scrap rates resulting from process deviations.
• Propose process enhancements by effectively evaluating test and yield data along with manufacturing defects, making necessary adjustments to process equipment.
• Program, troubleshoot, and maintain manufacturing process equipment as needed to achieve the desired yield targets.
• Assist engineering efforts to assess: solders, epoxies, and new equipment installations, providing both tactical and strategic recommendations.
• Create Manufacturing Work Instructions and production routes, and implement Engineering change orders as required.
• Familiarity with Statistical Process Control (SPC) and Risk Management/FMEA is essential.

Skills and Qualifications

• A Bachelor of Science or Engineering degree, preferably in Electronics or Electrical Engineering.
• Experience in a high mix and high volume manufacturing setting is a plus.
• Strong understanding of process problem-solving and analysis techniques.
• Proficient in computer skills, particularly with SAS JMP, Minitab, and SPC methodologies.
• Demonstrate strong analytical capabilities and a hands-on approach to machine troubleshooting, which is advantageous.
• Able to adapt swiftly and flexibly to the evolving business requirements of the organization.
• Experience in supervising and leading a team of process personnel is preferred.