Principal / Senior Engineer, Process (Dry Etch)

Overview

We invite you to become a part of our innovative team as a Principal/Senior Engineer with a focus on Etch. In this pivotal role, you will spearhead the development and refinement of cutting-edge etch processes that are critical in semiconductor manufacturing. This opportunity is perfect for professionals eager to apply their technical know-how in a collaborative and engaging environment.

Key Responsibilities

• Design and improve etch process formulations and methodologies to meet stringent quality standards. Evaluate technical data and performance indicators to guarantee etch efficiency, with an emphasis on minimizing non-uniformity, defects, and ensuring stable removal rates. Create and uphold Standard Operating Procedures (SOPs) and perform Failure Mode and Effects Analysis (FMEA) for the etch module. Integrate etch equipment capabilities and material systems to fulfill technology requirements. Lead the development and fine-tuning of recipes for etch tools, ensuring accurate process monitoring and improving recipe quality. Initiate Continuous Improvement Plans (CIPs) focused on enhancing process performance and efficiency. Collaborate with cross-functional teams to align with organizational goals. Act as a technical authority in etch, offering guidance and training to junior engineers. Address complex technical issues within the etch field. Contribute to the advancement of intellectual property by participating as an inventor on patents related to etch technologies.

Qualifications

• Master's or Bachelor's degree in Electrical, Electronics, Mechanical, Chemical, Materials Science Engineering, or a closely related discipline. A minimum of 5 to 8 years of pertinent experience in the wafer fabrication sector, specifically in etch processes. Excellent analytical capabilities combined with strong project management skills. A methodical and organized approach to problem-solving, with knowledge of Statistical Process Control (SPC), Design of Experiments (DOE), and FMEA.