Services Engineer (Semiconductor)

Primary Duties:

• Quickly identify and resolve technical issues to minimize downtime, specifically focusing on die bonding and wire bonding.
• Conduct on-site support tasks, including regular maintenance, calibration, and equipment servicing for semiconductor bonding machinery.
• Build and sustain strong customer relationships through consistent visits, technical consultations, and service follow-ups.
• Generate precise and detailed service reports, following up on customer inquiries to guarantee satisfaction and foster long-term business relationships.
• Suggest process enhancements or equipment upgrades to assist customers in improving operational efficiency and productivity.
• Work collaboratively with internal teams to communicate customer feedback for ongoing improvement and future product development.
• Ensure that all service activities are thoroughly documented and adhere to pertinent safety and quality standards.

Qualifications:

• A minimum of 3 years of practical experience with Shinkawa, Kulicke & Soffa, BESI, or ESEC semiconductor equipment.
• In-depth technical expertise in semiconductor backend processes and associated equipment.
• Demonstrated troubleshooting, analytical, and problem-solving skills.
• Exceptional interpersonal abilities with a strong emphasis on customer service.
• Ability to travel frequently to client locations, particularly within Kedah and surrounding areas.