Principal Process Engineer (Dry Etch, Unit Module Development)

Opportunity Overview:

Join a distinguished semiconductor foundry specializing in the production of intricate integrated circuits for electronic applications.

Position Details:

Technical Proficiency & Etch Process Development:

• Create and refine etch process formulations, methodologies, and equipment controls to adhere to rigorous quality benchmarks.
• Evaluate and scrutinize technical data and graphs to verify etch performance, emphasizing non-uniformity, defect levels, and stability of removal rates.
• Develop and uphold Standard Operating Procedures (SOPs) and conduct Failure Mode and Effects Analysis (FMEA) tailored to the etch module.
• Synchronize etch equipment capabilities with material systems to fulfill process module and technological specifications.
• Oversee the creation, maintenance, and enhancement of recipes for etch tools, ensuring precise process oversight and improved recipe quality.

Leadership & Collaboration:

• Champion Continuous Improvement Plans (CIPs) aimed at boosting process efficiency and productivity.
• Lead and engage with cross-disciplinary teams to meet organizational objectives.
• Act as a technical expert in etch, offering mentorship and training to junior engineers in the field.
• Engage with suppliers and internal teams for benchmarking and collaborative learning opportunities.
• Exhibit expertise in all facets of the etch technical area, earning recognition within the group as a senior technical team member.

Innovative Problem-Solving:

• Address complex, unique, and non-recurring technical challenges.
• Proactively recognize and implement substantial modifications to existing processes and methodologies.
• Contribute to the company’s intellectual property as an inventor on patents pertaining to etch technology.
• Take part in and contribute to publications in conferences or journals.

Safety & Compliance:

• Conduct all tasks in a safe and responsible manner.
• Adhere to all Environmental, Health, Safety & Security regulations.

Candidate Profile:

• Master's or Bachelor's Degree in Electrical, Electronics, Mechanical, Chemical, Materials Science Engineering, or a related field.
• 5 to 8 years of pertinent experience within the wafer fabrication sector, particularly with an emphasis on etch processes.
• Strong interpersonal and communication abilities.
• Solid analytical and project management capabilities.
• Methodical and organized in problem-solving, experienced with SPC, DOE, and FMEA methodologies.

Application Process:

• Interested candidates are encouraged to submit their resume to [HIDDEN TEXT], including current and expected salary details.
• Only shortlisted applicants will be contacted.

Koh Ying Chong

Consultant, Engineering | Permanent Recruitment

Personnel Registration No. R23116418

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