Dry Etch Process Development

• Spearhead next-generation NAND dry etch technology development
• Drive advancement in advanced semiconductor process R&D

About Our Client

Our client is a globally recognised semiconductor technology leader dedicated to memory and storage innovation. Operating across multiple countries, the organisation combines substantial R&D investment with advanced manufacturing capabilities to support next-generation technologies. Its work has a major impact on data centres, artificial intelligence, mobile devices, automotive applications, and cloud computing infrastructure.

Job Description

• Lead the development and optimisation of advanced dry etch processes for next-generation memory technologies.
• Introduce and refine process innovations to satisfy demanding device architecture, structural, and electrical performance requirements.
• Develop and deliver technology development strategies for essential semiconductor process modules.
• Work closely with process integration, lithography, deposition, wet process, CMP and metallisation teams to address complex manufacturing challenges.
• Collaborate with equipment engineering teams and external suppliers to define upcoming hardware and capability roadmaps.
• Lead technical investigations, root cause analyses, and problem-solving efforts focused on high aspect ratio and advanced pattern transfer applications.
• Share technical results, progress updates, and development strategies with senior stakeholders, while mentoring junior engineers and supporting technical leadership initiatives.

The Successful Applicant

• Bachelor's, Master's or PhD in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, Chemistry, Semiconductor Engineering or a related discipline.
• Strong experience supporting R&D and technology development programmes that transition into manufacturing environments.
• In-depth knowledge of plasma etching principles, plasma chemistry, surface interactions, and transport phenomena.
• Proven ability to lead complex technical projects and cross-functional engineering teams.
• Experience building solutions for high aspect ratio etch applications and advanced pattern transfer challenges.
• Strong understanding of semiconductor dry etch equipment, process characterisation techniques, and statistical process control.
• Experience coordinating supplier collaboration, conducting technical evaluations, and supporting equipment development initiatives.
• Proficiency with data analysis tools and statistical software, with exposure to data science, Python, automation or AI-driven process optimisation considered advantageous.

What's on Offer

• Chance to directly support the development of future-generation semiconductor memory technologies.
• Opportunity to engage with cutting-edge R&D programmes tackling some of the most difficult process integration challenges in the industry.
• Full learning and development programmes, including technical leadership training.
• International exposure through partnerships with global R&D, manufacturing, and equipment teams.

Contact

Eugenia NG (Lic No: R1108105 / EA no:18S9099)

Quote job ref

JN-092026-7114173

Phone number

+65 6541 9961

Michael Page International Pte Ltd | Registration No. 199804751N